Inventor

SHAHREZA MAJID K

US3 patents

Patents

3 patents

US6083569AJul 4, 2000

Discharging a wafer after a plasma process for dielectric deposition

APPLIED MATERIALS INC19 citations89

US10199388B2Feb 5, 2019

VNAND tensile thick TEOS oxide

APPLIED MATERIALS INC1 citations58

US10483282B2Nov 19, 2019

VNAND tensile thick TEOS oxide

APPLIED MATERIALS INC0 citations47