Inventor
MORITA TAKAAKI
JP19 patents
⚠️ This page may combine multiple inventors who share the name “MORITA TAKAAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
11 patentsUS8026614B2Sep 27, 2011
Semiconductor IC-embedded substrate and method for manufacturing same
TDK CORP17 citations92
US7247590B2Jul 24, 2007
Composite dielectric, composite dielectric sheet, composite dielectric paste, metal-layered composite dielectric, wiring board and multilayer wiring board
TDK CORP30 citations92
US7544537B2Jun 9, 2009
Semiconductor IC-embedded substrate and method for manufacturing same
TDK CORP9 citations84
US7906370B2Mar 15, 2011
Mounting method of electronic components, manufacturing method of electronic component-embedded substrate, and electronic component-embedded substrate
TDK CORP12 citations83
US11412621B2Aug 9, 2022
Device-embedded board and method of manufacturing the same
TDK CORP2 citations72
US11546989B2Jan 3, 2023
Multilayer board insulating sheet, multilayer board, and method of manufacturing multilayer board
TDK CORP0 citations57
US11335614B2May 17, 2022
Electric component embedded structure
TDK CORP0 citations52
US12505958B2Dec 23, 2025
Solid electrolytic capacitor including a valve metal support and a cathode
TDK CORP0 citations51
US11382218B2Jul 5, 2022
Printed wiring board and method for manufacturing the same
TDK CORP0 citations51
US10905013B2Jan 26, 2021
Printed wiring board and method for manufacturing the same
TDK CORP0 citations51
US11445605B2Sep 13, 2022
Printed wiring board, multilayer printed wiring board and method for manufacturing printed wiring board
TDK CORP0 citations46