Inventor

HAGLEITNER HELMUT

US33 patents

⚠️ This page may combine multiple inventors who share the name “HAGLEITNER HELMUT”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HAGLEITNER HELMUT

CREE INC

Method of forming vias in silicon carbide and resulting devices and circuits

Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same

Method of forming vias in silicon carbide and resulting devices and circuits

Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides

Methods of fabricating high voltage, high temperature capacitor and interconnection structures

High voltage, high temperature capacitor and interconnection structures

Encapsulation of advanced devices using novel PECVD and ALD schemes

Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides

Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor devices

Semiconductor device with improved field plate

Ni-rich Schottky contact

Semiconductor device with improved field plate

Wafer-level die attach metallization

Wafer-level die attach metallization

Gate contact for a semiconductor device and methods of fabrication thereof

Hydrogen mitigation schemes in the passivation of advanced devices

Method of forming vias in silicon carbide and resulting devices and circuits

Dielectric solder barrier for semiconductor devices

Gate contact for a semiconductor device and methods of fabrication thereof

Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features

Using stress reduction barrier sub-layers in a semiconductor die

MIECZKOWSKI VAN

Multilayer diffusion barriers for wide bandgap Schottky barrier devices

Semiconductor devices having gates including oxidized nickel

Semiconductor devices having improved adhesion and methods of fabricating the same

Contact pad

Polymer via plugs with high thermal integrity

HAGLEITNER HELMUT

Ohmic contact to semiconductor device

Methods of forming contact structures including alternating metal and silicon layers and related devices

Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features

Schottky contact

RING ZOLTAN

Method of forming vias in silicon carbide and resulting devices and circuits

Method of forming vias in silicon carbide and resulting devices and circuits

SRIRAM SAPTHARISHI

Diode having reduced on-resistance and associated method of manufacture