Inventor
SHIEH JYU-HORNG
TW125 patents
⚠️ This page may combine multiple inventors who share the name “SHIEH JYU-HORNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
34 patentsUS8987142B2Mar 24, 2015
Multi-patterning method and device formed by the method
TAIWAN SEMICONDUCTOR MFG CO LTD119 citations98
US10276794B1Apr 30, 2019
Memory device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US9991200B2Jun 5, 2018
Air gap structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US9123656B1Sep 1, 2015
Organosilicate polymer mandrel for self-aligned double patterning process
TAIWAN SEMICONDUCTOR MFG CO LTD45 citations94
US9711372B2Jul 18, 2017
Double patterning method
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations93
US11101429B2Aug 24, 2021
Metal etching stop layer in magnetic tunnel junction memory cells
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10862023B2Dec 8, 2020
Semiconductor structure and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10714383B2Jul 14, 2020
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10651373B2May 12, 2020
Memory device and fabrication method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10651047B2May 12, 2020
Double patterning method
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10109497B2Oct 23, 2018
Double patterning method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US9966309B2May 8, 2018
Contact plug without seam hole and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9892960B2Feb 13, 2018
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9472448B2Oct 18, 2016
Contact plug without seam hole and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9401329B2Jul 26, 2016
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9240346B2Jan 19, 2016
Double patterning method
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US8962432B2Feb 24, 2015
Semiconductor device with self aligned end-to-end conductive line structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11676821B2Jun 13, 2023
Self-aligned double patterning
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12219879B2Feb 4, 2025
Gradient protection layer in MTJ manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations74
US12127489B2Oct 22, 2024
Integrated circuit structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11683991B2Jun 20, 2023
Semiconductor structure and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11411176B2Aug 9, 2022
Gradient protection layer in MTJ manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10867840B2Dec 15, 2020
Method of forming a semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10868239B2Dec 15, 2020
Gradient protection layer in MTJ manufacturing
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10290538B2May 14, 2019
Interconnect structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9929094B2Mar 27, 2018
Semiconductor device having air gap structures and method of fabricating thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9887126B2Feb 6, 2018
Structure of dual damascene structures having via hole and trench
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9627250B2Apr 18, 2017
Method and apparatus for back end of line semiconductor device processing
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9601348B2Mar 21, 2017
Interconnect structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9570341B2Feb 14, 2017
Semiconductor device having air gap structures and method of fabricating thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9496224B2Nov 15, 2016
Semiconductor device having air gap structures and method of fabricating thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11404245B2Aug 2, 2022
DC bias in plasma process
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10510553B1Dec 17, 2019
Dry ashing by secondary excitation
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US9502287B2Nov 22, 2016
Method of preventing pattern collapse
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
TAIWAN SEMICONDUCTOR MFG
16 patentsUS9153478B2Oct 6, 2015
Spacer etching process for integrated circuit design
TAIWAN SEMICONDUCTOR MFG118 citations99
US6790770B2Sep 14, 2004
Method for preventing photoresist poisoning
TAIWAN SEMICONDUCTOR MFG46 citations93
US7968506B2Jun 28, 2011
Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process
TAIWAN SEMICONDUCTOR MFG20 citations92
US7094689B2Aug 22, 2006
Air gap interconnect structure and method thereof
TAIWAN SEMICONDUCTOR MFG23 citations92
US7015133B2Mar 21, 2006
Dual damascene structure formed of low-k dielectric materials
TAIWAN SEMICONDUCTOR MFG31 citations92
US6383943B1May 7, 2002
Process for improving copper fill integrity
TAIWAN SEMICONDUCTOR MFG27 citations90
US8828885B2Sep 9, 2014
Photo resist trimmed line end space
TAIWAN SEMICONDUCTOR MFG5 citations84
US8669180B1Mar 11, 2014
Semiconductor device with self aligned end-to-end conductive line structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG15 citations84
US8633108B1Jan 21, 2014
Dual damascene process
TAIWAN SEMICONDUCTOR MFG13 citations84
US7256498B2Aug 14, 2007
Resistance-reduced semiconductor device and methods for fabricating the same
TAIWAN SEMICONDUCTOR MFG14 citations84
US7074727B2Jul 11, 2006
Process for improving dielectric properties in low-k organosilicate dielectric material
TAIWAN SEMICONDUCTOR MFG17 citations84
US9153479B2Oct 6, 2015
Method of preventing a pattern collapse
TAIWAN SEMICONDUCTOR MFG7 citations83
US6297168B1Oct 2, 2001
Edge defect inhibited trench etch plasma etch method
TAIWAN SEMICONDUCTOR MFG18 citations82
US7241674B2Jul 10, 2007
Method of forming silicided gate structure
TAIWAN SEMICONDUCTOR MFG7 citations74
US8841214B2Sep 23, 2014
Dual damascene process
TAIWAN SEMICONDUCTOR MFG4 citations73
US7029992B2Apr 18, 2006
Low oxygen content photoresist stripping process for low dielectric constant materials
TAIWAN SEMICONDUCTOR MFG9 citations73
Showing the top 50 of 125 patents by PatentIndex Score.