P

Inventor

SHIEH JYU-HORNG

TW125 patents
⚠️ This page may combine multiple inventors who share the name “SHIEH JYU-HORNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

34 patents
US8987142B2Mar 24, 2015

Multi-patterning method and device formed by the method

TAIWAN SEMICONDUCTOR MFG CO LTD119 citations98
US10276794B1Apr 30, 2019

Memory device and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US9991200B2Jun 5, 2018

Air gap structure and method

TAIWAN SEMICONDUCTOR MFG CO LTD18 citations94
US9123656B1Sep 1, 2015

Organosilicate polymer mandrel for self-aligned double patterning process

TAIWAN SEMICONDUCTOR MFG CO LTD45 citations94
US9711372B2Jul 18, 2017

Double patterning method

TAIWAN SEMICONDUCTOR MFG CO LTD12 citations93
US11101429B2Aug 24, 2021

Metal etching stop layer in magnetic tunnel junction memory cells

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10862023B2Dec 8, 2020

Semiconductor structure and manufacturing method of the same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10714383B2Jul 14, 2020

Interconnect structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10651373B2May 12, 2020

Memory device and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10651047B2May 12, 2020

Double patterning method

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10109497B2Oct 23, 2018

Double patterning method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations84
US9966309B2May 8, 2018

Contact plug without seam hole and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9892960B2Feb 13, 2018

Interconnect structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9472448B2Oct 18, 2016

Contact plug without seam hole and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US9401329B2Jul 26, 2016

Interconnect structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9240346B2Jan 19, 2016

Double patterning method

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US8962432B2Feb 24, 2015

Semiconductor device with self aligned end-to-end conductive line structure and method for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US11676821B2Jun 13, 2023

Self-aligned double patterning

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations75
US12219879B2Feb 4, 2025

Gradient protection layer in MTJ manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations74
US12127489B2Oct 22, 2024

Integrated circuit structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11683991B2Jun 20, 2023

Semiconductor structure and manufacturing method of the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11411176B2Aug 9, 2022

Gradient protection layer in MTJ manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10867840B2Dec 15, 2020

Method of forming a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US10868239B2Dec 15, 2020

Gradient protection layer in MTJ manufacturing

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10290538B2May 14, 2019

Interconnect structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9929094B2Mar 27, 2018

Semiconductor device having air gap structures and method of fabricating thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9887126B2Feb 6, 2018

Structure of dual damascene structures having via hole and trench

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9627250B2Apr 18, 2017

Method and apparatus for back end of line semiconductor device processing

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9601348B2Mar 21, 2017

Interconnect structure and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9570341B2Feb 14, 2017

Semiconductor device having air gap structures and method of fabricating thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9496224B2Nov 15, 2016

Semiconductor device having air gap structures and method of fabricating thereof

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11404245B2Aug 2, 2022

DC bias in plasma process

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10510553B1Dec 17, 2019

Dry ashing by secondary excitation

TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US9502287B2Nov 22, 2016

Method of preventing pattern collapse

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72

TAIWAN SEMICONDUCTOR MFG

16 patents
US9153478B2Oct 6, 2015

Spacer etching process for integrated circuit design

TAIWAN SEMICONDUCTOR MFG118 citations99
US6790770B2Sep 14, 2004

Method for preventing photoresist poisoning

TAIWAN SEMICONDUCTOR MFG46 citations93
US7968506B2Jun 28, 2011

Wet cleaning stripping of etch residue after trench and via opening formation in dual damascene process

TAIWAN SEMICONDUCTOR MFG20 citations92
US7094689B2Aug 22, 2006

Air gap interconnect structure and method thereof

TAIWAN SEMICONDUCTOR MFG23 citations92
US7015133B2Mar 21, 2006

Dual damascene structure formed of low-k dielectric materials

TAIWAN SEMICONDUCTOR MFG31 citations92
US6383943B1May 7, 2002

Process for improving copper fill integrity

TAIWAN SEMICONDUCTOR MFG27 citations90
US8828885B2Sep 9, 2014

Photo resist trimmed line end space

TAIWAN SEMICONDUCTOR MFG5 citations84
US8669180B1Mar 11, 2014

Semiconductor device with self aligned end-to-end conductive line structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG15 citations84
US8633108B1Jan 21, 2014

Dual damascene process

TAIWAN SEMICONDUCTOR MFG13 citations84
US7256498B2Aug 14, 2007

Resistance-reduced semiconductor device and methods for fabricating the same

TAIWAN SEMICONDUCTOR MFG14 citations84
US7074727B2Jul 11, 2006

Process for improving dielectric properties in low-k organosilicate dielectric material

TAIWAN SEMICONDUCTOR MFG17 citations84
US9153479B2Oct 6, 2015

Method of preventing a pattern collapse

TAIWAN SEMICONDUCTOR MFG7 citations83
US6297168B1Oct 2, 2001

Edge defect inhibited trench etch plasma etch method

TAIWAN SEMICONDUCTOR MFG18 citations82
US7241674B2Jul 10, 2007

Method of forming silicided gate structure

TAIWAN SEMICONDUCTOR MFG7 citations74
US8841214B2Sep 23, 2014

Dual damascene process

TAIWAN SEMICONDUCTOR MFG4 citations73
US7029992B2Apr 18, 2006

Low oxygen content photoresist stripping process for low dielectric constant materials

TAIWAN SEMICONDUCTOR MFG9 citations73

Showing the top 50 of 125 patents by PatentIndex Score.