Inventor
HSU HUNG-WEN
TW35 patents
⚠️ This page may combine multiple inventors who share the name “HSU HUNG-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
26 patentsUS10163974B2Dec 25, 2018
Method of forming absorption enhancement structure for image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD21 citations94
US10395974B1Aug 27, 2019
Method for forming a thin semiconductor-on-insulator (SOI) substrate
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US10304898B2May 28, 2019
Absorption enhancement structure for image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9917121B2Mar 13, 2018
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US10804315B2Oct 13, 2020
Absorption enhancement structure for image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510799B2Dec 17, 2019
Absorption enhancement structure for image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9991303B2Jun 5, 2018
Image sensor device structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11315972B2Apr 26, 2022
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10269843B2Apr 23, 2019
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10170536B1Jan 1, 2019
Magnetic memory with metal oxide etch stop layer and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations69
US12563852B2Feb 24, 2026
Uniform trenches in semiconductor devices and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12557305B2Feb 17, 2026
Integrated chip inductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11916091B2Feb 27, 2024
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11784211B2Oct 10, 2023
Integrated chip inductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11522004B2Dec 6, 2022
Absorption enhancement structure for image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11139239B2Oct 5, 2021
Recessed inductor structure to reduce step height
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12396272B2Aug 19, 2025
Stilted pad structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10840287B2Nov 17, 2020
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10361234B2Jul 23, 2019
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10164156B2Dec 25, 2018
Structure and formation method of image sensor structure with grid structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163972B2Dec 25, 2018
Image sensing device with photon blocking layer and anti-reflective coating
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9941320B2Apr 10, 2018
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10847560B2Nov 24, 2020
BSI image sensor and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US12046477B2Jul 23, 2024
By-site-compensated etch back for local planarization/topography adjustment
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US12132075B2Oct 29, 2024
Method (and related apparatus) for forming a resistor over a semiconductor substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations46
US10084056B1Sep 25, 2018
Semiconductor structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
TAIWAN SEMICONDUCTOR MFG
4 patentsUS9293392B2Mar 22, 2016
3DIC interconnect apparatus and method
TAIWAN SEMICONDUCTOR MFG4 citations82
US8791571B1Jul 29, 2014
System and method for preventing etch arcing during semiconductor processing
TAIWAN SEMICONDUCTOR MFG4 citations73
US9337225B2May 10, 2016
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG2 citations62
US8889460B2Nov 18, 2014
Sidewall for backside illuminated image sensor metal grid and method of manufacturing same
TAIWAN SEMICONDUCTOR MFG0 citations52