Inventor
MONT FRANK W
US26 patents
⚠️ This page may combine multiple inventors who share the name “MONT FRANK W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
GLOBALFOUNDRIES INC
14 patentsUS9831174B1Nov 28, 2017
Devices and methods of forming low resistivity noble metal interconnect
GLOBALFOUNDRIES INC9 citations84
US9373543B1Jun 21, 2016
Forming interconnect features with reduced sidewall tapering
GLOBALFOUNDRIES INC19 citations80
US9831124B1Nov 28, 2017
Interconnect structures
GLOBALFOUNDRIES INC3 citations73
US9799555B1Oct 24, 2017
Cobalt interconnects covered by a metal cap
GLOBALFOUNDRIES INC5 citations73
US10062560B1Aug 28, 2018
Method of cleaning semiconductor device
GLOBALFOUNDRIES INC3 citations72
US9799559B1Oct 24, 2017
Methods employing sacrificial barrier layer for protection of vias during trench formation
GLOBALFOUNDRIES INC2 citations69
US10679937B2Jun 9, 2020
Devices and methods of forming low resistivity noble metal interconnect
GLOBALFOUNDRIES INC0 citations52
US10636656B2Apr 28, 2020
Methods of protecting structure of integrated circuit from rework
GLOBALFOUNDRIES INC0 citations52
US10636698B2Apr 28, 2020
Skip via structures
GLOBALFOUNDRIES INC0 citations52
US10262892B2Apr 16, 2019
Skip via structures
GLOBALFOUNDRIES INC0 citations52
US10056291B2Aug 21, 2018
Post spacer self-aligned cuts
GLOBALFOUNDRIES INC1 citations51
US10056292B2Aug 21, 2018
Self-aligned lithographic patterning
GLOBALFOUNDRIES INC0 citations51
US10157833B1Dec 18, 2018
Via and skip via structures
GLOBALFOUNDRIES INC1 citations50
US10658176B2May 19, 2020
Methods of mitigating cobalt diffusion in contact structures and the resulting devices
GLOBALFOUNDRIES INC0 citations48
IBM
7 patentsUS9613862B2Apr 4, 2017
Chamferless via structures
IBM14 citations91
US10032668B2Jul 24, 2018
Chamferless via structures
IBM4 citations82
US10388565B2Aug 20, 2019
Chamferless via structures
IBM1 citations71
US10957588B2Mar 23, 2021
Chamferless via structures
IBM0 citations61
US10937694B2Mar 2, 2021
Chamferless via structures
IBM0 citations61
US10903118B2Jan 26, 2021
Chamferless via structures
IBM0 citations61
US9947547B2Apr 17, 2018
Environmentally green process and composition for cobalt wet etch
IBM1 citations52
GLOBALFOUNDRIES US INC
3 patentsUS11610839B2Mar 21, 2023
Dummy fill structures
GLOBALFOUNDRIES US INC0 citations56
US11362177B2Jun 14, 2022
Epitaxial semiconductor material regions for transistor devices and methods of forming same
GLOBALFOUNDRIES US INC0 citations51
US11205699B2Dec 21, 2021
Epitaxial semiconductor material regions for transistor devices and methods of forming same
GLOBALFOUNDRIES US INC0 citations51