Inventor
LAM STEPHEN
CN118 patents
⚠️ This page may combine multiple inventors who share the name “LAM STEPHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PDF SOLUTIONS INC
27 patentsUS9870962B1Jan 16, 2018
Integrated circuit including NCEM-enabled, interlayer overlap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
PDF SOLUTIONS INC13 citations96
US9805994B1Oct 31, 2017
Mesh-style NCEM pads, and process for making semiconductor dies, chips, and wafers using in-line measurements from such pads
PDF SOLUTIONS INC15 citations93
US9799575B2Oct 24, 2017
Integrated circuit containing DOEs of NCEM-enabled fill cells
PDF SOLUTIONS INC19 citations93
US9627370B1Apr 18, 2017
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and TS-short-configured, NCEM-enabled fill cells
PDF SOLUTIONS INC15 citations93
US10978438B1Apr 13, 2021
IC with test structures and E-beam pads embedded within a contiguous standard cell area
PDF SOLUTIONS INC9 citations86
US10593604B1Mar 17, 2020
Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells
PDF SOLUTIONS INC19 citations86
US10199288B1Feb 5, 2019
Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one side-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective side-to-side short, corner short, and via open test areas
PDF SOLUTIONS INC2 citations84
US10199283B1Feb 5, 2019
Method for processing a semiconductor wager using non-contact electrical measurements indicative of a resistance through a stitch, where such measurements are obtained by scanning a pad comprised of at least three parallel conductive stripes using a moving stage with beam deflection to account for motion of the stage
PDF SOLUTIONS INC3 citations84
US9905487B1Feb 27, 2018
Process for making semiconductor dies, chips, and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on test wafers that include multiple means/steps for enabling NC detection of V0 via opens
PDF SOLUTIONS INC3 citations84
US9786648B1Oct 10, 2017
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATECNT-short-configured, and TS-short-configured, NCEM-enabled fill cells
PDF SOLUTIONS INC2 citations84
US9773773B1Sep 26, 2017
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and GATECNT-short-configured, NCEM-enabled fill cells
PDF SOLUTIONS INC2 citations84
US9761575B1Sep 12, 2017
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least chamfer-short-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells
PDF SOLUTIONS INC2 citations84
US9741703B1Aug 22, 2017
Integrated circuit containing standard logic cells and ilbrary-compatible, NCEM-enabled fill cells, including at least via-open-configured, gate-short-configured, TS-short-configured, and AA-short-conigured, NCEM-enabled fill cells
PDF SOLUTIONS INC4 citations84
US9691672B1Jun 27, 2017
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and metal-short-configured, NCEM-enabled fill cells
PDF SOLUTIONS INC4 citations84
US9627371B1Apr 18, 2017
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, GATE-short-configured, GATECNT-short-configured, and AA-short-configured, NCEM-enabled fill cells
PDF SOLUTIONS INC7 citations84
US9947601B1Apr 17, 2018
Integrated circuit including NCEM-enabled, side-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
PDF SOLUTIONS INC1 citations74
US9922968B1Mar 20, 2018
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including chamfer short configured fill cells
PDF SOLUTIONS INC1 citations74
US9721937B1Aug 1, 2017
Integrated circuit containing first and second does of standard cell compatible, NCEM-enabled fill cells, with the first DOE including side-to-side short configured fill cells, and the second DOE including tip-to-tip short configured fill cells
PDF SOLUTIONS INC1 citations74
US10290552B1May 14, 2019
Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage
PDF SOLUTIONS INC2 citations73
US10199294B1Feb 5, 2019
Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage
PDF SOLUTIONS INC1 citations73
US10096530B1Oct 9, 2018
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including stitch open configured fill cells
PDF SOLUTIONS INC4 citations73
US9929063B1Mar 27, 2018
Process for making an integrated circuit that includes NCEM-Enabled, tip-to-side gap-configured fill cells, with NCEM pads formed from at least three conductive stripes positioned between adjacent gates
PDF SOLUTIONS INC2 citations73
US9911649B1Mar 6, 2018
Process for making and using mesh-style NCEM pads
PDF SOLUTIONS INC2 citations73
US9773774B1Sep 26, 2017
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including chamfer short configured fill cells, and the second DOE including corner short configured fill cells
PDF SOLUTIONS INC4 citations73
US9768083B1Sep 19, 2017
Process for making and using a semiconductor wafer containing first and second DOEs of standard cell compatible, NCEM-enabled fill cells, with the first DOE including merged-via open configured fill cells, and the second DOE including snake open configured fill cells
PDF SOLUTIONS INC2 citations73
US9761573B1Sep 12, 2017
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, GATE-short-configured, and TS-short-configured, NCEM-enabled fill cells
PDF SOLUTIONS INC2 citations73
US9653446B1May 16, 2017
Integrated circuit containing standard logic cells and library-compatible, NCEM-enabled fill cells, including at least via-open-configured, AACNT-short-configured, TS-short-configured, and AA-short-configured, NCEM-enabled fill cells
PDF SOLUTIONS INC2 citations73
CERTIFIED GUARANTY COMPANY LLC
7 patentsUSD993324SJul 25, 2023
Case for a trading card
CERTIFIED GUARANTY COMPANY LLC18 citations86
USD971338SNov 29, 2022
Case for a trading card
CERTIFIED GUARANTY COMPANY LLC10 citations82
USD851910SJun 25, 2019
Base of a comic book case
CERTIFIED GUARANTY COMPANY LLC4 citations82
USD851911SJun 25, 2019
Cover of a comic book case
CERTIFIED GUARANTY COMPANY LLC10 citations82
USD833732SNov 20, 2018
Case for authenticated comic book
CERTIFIED GUARANTY COMPANY LLC8 citations82
US9840106B2Dec 12, 2017
Case for authenticated comic book
CERTIFIED GUARANTY COMPANY LLC4 citations82
US10286714B2May 14, 2019
Case for authenticated comic book
CERTIFIED GUARANTY COMPANY LLC1 citations71
(unassigned)
3 patentsUS6546272B1Apr 8, 2003
Apparatus for in vivo imaging of the respiratory tract and other internal organs
332 citations99
US6826424B1Nov 30, 2004
Methods and apparatus for fluorescence and reflectance imaging and spectroscopy and for contemporaneous measurements of electromagnetic radiation with multiple measuring devices
122 citations97
US6898458B2May 24, 2005
Methods and apparatus for fluorescence and reflectance imaging and spectroscopy and for contemporaneous measurements of electromagnetic radiation with multiple measuring devices
115 citations95
XILLIX TECHNOLOGIES CORP
3 patentsUS5827190AOct 27, 1998
Endoscope having an integrated CCD sensor
XILLIX TECHNOLOGIES CORP487 citations98
US5590660AJan 7, 1997
Apparatus and method for imaging diseased tissue using integrated autofluorescence
XILLIX TECHNOLOGIES CORP677 citations98
US5507287AApr 16, 1996
Endoscopic imaging system for diseased tissue
XILLIX TECHNOLOGIES CORP402 citations96
PERCEPTRONIX MEDICAL INC
3 patentsUS7253894B2Aug 7, 2007
Image detection apparatus for fluorescence and reflectance imaging and spectroscopy and for contemporaneous measurements of electromagnetic radiation with multiple measuring devices
PERCEPTRONIX MEDICAL INC68 citations96
US7115841B2Oct 3, 2006
Imaging methods for fluorescence and reflectance imaging and spectroscopy and for contemporaneous measurements of electromagnetic radiation with multiple measuring devices
PERCEPTRONIX MEDICAL INC45 citations94
US7190452B2Mar 13, 2007
Imaging systems for fluorescence and reflectance imaging and spectroscopy and for contemporaneous measurements of electromagnetic radiation with multiple measuring devices
PERCEPTRONIX MEDICAL INC14 citations91
NUMISMATIC GUARANTY CORP NGC
2 patentsONCOMETRICS IMAGING CORP
1 patentCIBA GEIGY CORP
1 patentBRITISH COLUMBIA CANCER AGENCY BRANCH
1 patentUNIV BOSTON
1 patentNUMISMATIC GUARANTY CORP
1 patentShowing the top 50 of 118 patents by PatentIndex Score.