Inventor
O'CONNELL KEVIN M
US34 patents
⚠️ This page may combine multiple inventors who share the name “O'CONNELL KEVIN M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
30 patentsUS10331911B2Jun 25, 2019
Secure crypto module including security layers
IBM7 citations84
US9872399B1Jan 16, 2018
Implementing backdrilling elimination utilizing anti-electroplate coating
IBM13 citations84
US9872398B1Jan 16, 2018
Implementing backdrilling elimination utilizing via plug during electroplating
IBM5 citations84
US9482833B1Nov 1, 2016
Light pipe connector apparatus
IBM8 citations83
US9937662B2Apr 10, 2018
Shape memory thermal interface materials
IBM3 citations73
US9873774B1Jan 23, 2018
Shape memory thermal interface materials
IBM4 citations73
US9721855B2Aug 1, 2017
Alignment of three dimensional integrated circuit components
IBM3 citations73
US9974202B1May 15, 2018
Electronic equipment divider assembly
IBM3 citations71
US10231356B2Mar 12, 2019
Cold plate
IBM1 citations62
US10798829B2Oct 6, 2020
Implementing backdrilling elimination utilizing anti-electroplate coating
IBM0 citations52
US10750623B2Aug 18, 2020
Forming conductive vias using healing layer
IBM0 citations52
US10531576B2Jan 7, 2020
Implementing backdrilling elimination utilizing via plug during electroplating
IBM0 citations52
US10383216B2Aug 13, 2019
Tamper detection circuits
IBM0 citations52
US10299366B2May 21, 2019
Tamper detection circuits
IBM0 citations52
US10253157B2Apr 9, 2019
Shape memory thermal interface materials
IBM0 citations52
US10076045B2Sep 11, 2018
Implementing backdrilling elimination utilizing anti-electroplate coating
IBM0 citations52
US10045437B2Aug 7, 2018
Mitigation of warping of electronic components
IBM0 citations52
US9915316B2Mar 13, 2018
Pallet design for vibration mitigation
IBM0 citations52
US9732821B2Aug 15, 2017
Pallet design for vibration mitigation
IBM1 citations52
US9508614B2Nov 29, 2016
Alignment of three dimensional integrated circuit components
IBM0 citations52
US9494752B2Nov 15, 2016
Dual optical and electrical LGA contact
IBM0 citations52
US9414528B2Aug 9, 2016
Thermal spreading for an externally pluggable electronic module
IBM0 citations52
US9414527B2Aug 9, 2016
Thermal spreading for an externally pluggable electronic module
IBM0 citations52
US9389379B1Jul 12, 2016
Dual optical and electrical LGA contact
IBM0 citations52
US9299591B1Mar 29, 2016
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars
IBM0 citations52
US9299686B1Mar 29, 2016
Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars
IBM0 citations52
US9726837B2Aug 8, 2017
Light pipe connector apparatus
IBM0 citations51
US9992900B2Jun 5, 2018
Electronic equipment divider assembly
IBM0 citations50
US9940920B2Apr 10, 2018
Managing a set of devices using a set of acoustic emission data
IBM0 citations41
US10650098B2May 12, 2020
Content analyzer and recommendation tool
IBM0 citations34