Inventor
LO CHI CHUEN
CN2 patents
Patents
2 patentsUS9057853B2Jun 16, 2015
Apparatus having an embedded 3D hybrid integration for optoelectronic interconnects
LAU HON SHING24 citations89
US8604603B2Dec 10, 2013
Apparatus having thermal-enhanced and cost-effective 3D IC integration structure with through silicon via interposers
LAU HON SHING33 citations89