Inventor
YEN HAO-LIN
TW4 patents
Patents
4 patentsUS12512395B2Dec 30, 2025
Chip packaging method and chip package unit
RICHTEK TECHNOLOGY CORP0 citations57
US12300565B2May 13, 2025
Chip package unit and chip packaging method
RICHTEK TECHNOLOGY CORP0 citations57
US11973010B2Apr 30, 2024
Chip packaging method and chip package unit
RICHTEK TECHNOLOGY CORP0 citations57
US11469162B2Oct 11, 2022
Plurality of vertical heat conduction elements attached to metal film
RICHTEK TECHNOLOGY CORP0 citations47