Inventor
YAP ENG HOOI
MY3 patents
Patents
3 patentsUS7789285B2Sep 7, 2010
Solder printing process to reduce void formation in a microvia
INTEL CORP2 citations56
US7331503B2Feb 19, 2008
Solder printing process to reduce void formation in a microvia
INTEL CORP0 citations45
US7400040B2Jul 15, 2008
Thermal interface apparatus, systems, and methods
INTEL CORP0 citations34