Inventor
BLAIR CHRISTINE
US4 patents
⚠️ This page may combine multiple inventors who share the name “BLAIR CHRISTINE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QORVO US INC
3 patentsUS12334413B2Jun 17, 2025
System in package with flip chip die over multi-layer heatsink stanchion
QORVO US INC0 citations59
US11942391B2Mar 26, 2024
System in package with flip chip die over multi-layer heatsink stanchion
QORVO US INC1 citations59
US10872837B2Dec 22, 2020
Air-cavity semiconductor package with low cost high thermal carrier
QORVO US INC0 citations36