Inventor

ALVARADO REYNANTE

US7 patents

⚠️ This page may combine multiple inventors who share the name “ALVARADO REYNANTE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALVARADO REYNANTE

2 patents

US8188606B2May 29, 2012

Solder bump interconnect

ALVARADO REYNANTE12 citations79

US8446019B2May 21, 2013

Solder bump interconnect

ALVARADO REYNANTE3 citations58

MAXIM INTEGRATED PRODUCTS

2 patents

US9159684B1Oct 13, 2015

Wafer-level packaged device having self-assembled resilient leads

MAXIM INTEGRATED PRODUCTS4 citations72

US9425160B1Aug 23, 2016

Wafer-level package device with solder bump reinforcement

MAXIM INTEGRATED PRODUCTS3 citations71

FLIPCHIP INT LLC

1 patent

US7973418B2Jul 5, 2011

Solder bump interconnect for improved mechanical and thermo-mechanical performance

FLIPCHIP INT LLC27 citations89

PARVARANDEH PIROOZ

1 patent

US8686560B2Apr 1, 2014

Wafer-level chip-scale package device having bump assemblies configured to mitigate failures due to stress

PARVARANDEH PIROOZ15 citations83

LO CHIUNG C

1 patent

US8278748B2Oct 2, 2012

Wafer-level packaged device having self-assembled resilient leads

LO CHIUNG C6 citations82