Inventor

GREENLEE JORDAN D

US123 patents

⚠️ This page may combine multiple inventors who share the name “GREENLEE JORDAN D”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GREENLEE JORDAN D

MICRON TECHNOLOGY INC

Methods of filling horizontally-extending openings of integrated assemblies

Assemblies having vertically-stacked conductive structures

Methods of forming tungsten structures

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Integrated assemblies and methods of forming integrated assemblies

Microelectronic devices including conductive rails, and related methods

Assemblies having conductive structures with three or more different materials

Integrated assemblies, and methods of forming integrated assemblies

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Apparatus including a dielectric material in a central portion of a contact via, and related methods, memory devices and electronic systems

Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems

Integrated assemblies having one or more modifying substances distributed within semiconductor material, and methods of forming integrated assemblies

Assemblies having conductive structures with three or more different materials

Methods of filling horizontally-extending openings of integrated assemblies

Methods of filling openings with conductive material, and assemblies having vertically-stacked conductive structures

Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems

Methods used in forming an array of elevationally-extending transistors

Methods of forming tungsten structures

Tungsten structures and methods of forming the structures

Tungsten structures and methods of forming the structures

Conductive interconnects suitable for utilization in integrated assemblies, and methods of forming conductive interconnects

Staircase formation in a memory array

Metal-containing structures, and methods of treating metal-containing material to increase grain size and/or reduce contaminant concentration

Microelectronic devices comprising a boron-containing material, and related electronic systems and methods

Memory arrays comprising strings of memory cells with conductive islands

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Methods of forming microelectronic devices

Integrated assemblies, and methods of forming integrated assemblies

Integrated assemblies comprising conductive levels having two different metal-containing structures laterally adjacent one another, and methods of forming integrated assemblies

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Three-dimensional memory with conductive rails in conductive tiers, and related apparatus, systems, and methods

Integrated assemblies, and methods of forming integrated assemblies

Metal-containing structures, and methods of treating metal-containing material to increase grain size and/or reduce contaminant concentration

Methods of forming microelectronic devices, and related microelectronic devices, memory devices, and electronic systems

Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies comprising conductive levels having two different metal-containing structures laterally adjacent one another, and methods of forming integrated assemblies

Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies

Memory device including control gates having tungsten structure

Memory devices including conductive rails, and related methods and electronic systems

Microelectronic devices including cap structures, and related electronic systems and methods

Integrated assemblies and methods of forming integrated assemblies

Barrier structure for preventing etching to control circuitry

LODESTAR LICENSING GROUP LLC

Apparatuses including a conductive contact including a dielectric material surrounded by a conductive material

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Memory arrays comprising strings of memory cells and methods used in forming a memory array comprising strings of memory cells

Apparatuses including interconnect structures including dielectric material surrounded by conductive material, and related memory devices

Integrated assemblies and methods of forming integrated assemblies

Integrated assemblies having vertically-spaced channel material segments, and methods of forming integrated assemblies

Integrated assemblies, and methods of forming integrated assemblies