Inventor

FONG JOHN WAI

US9 patents

⚠️ This page may combine multiple inventors who share the name “FONG JOHN WAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

3D SYSTEMS INC

3 patents

US8377623B2Feb 19, 2013

Photocurable resin composition for producing three dimensional articles having high clarity

3D SYSTEMS INC34 citations91

US11479683B2Oct 25, 2022

Inks comprising liquid rubber for 3D printing

3D SYSTEMS INC0 citations59

US11292927B2Apr 5, 2022

Inks comprising liquid rubber for 3D printing

3D SYSTEMS INC0 citations59

HUNTSMAN ADV MAT AMERICAS INC

2 patents

US7307123B2Dec 11, 2007

Photocurable compositions containing reactive particles

HUNTSMAN ADV MAT AMERICAS INC19 citations92

US7820275B2Oct 26, 2010

Photocurable composition for producing cured articles having high clarity and improved mechanical properties

HUNTSMAN ADV MAT AMERICAS INC3 citations60

HUNTSMAN ADVANCED MATERIALS AMERICAS LLC

1 patent

US7964248B2Jun 21, 2011

Dual photoinitiator, photocurable composition, use thereof and process for producing a three dimensional article

HUNTSMAN ADVANCED MATERIALS AMERICAS LLC30 citations87

JOHNSON DAVID

1 patent

US8182882B2May 22, 2012

Method of making a 3-D object from photocurable compositions containing reactive polysiloxane particles

JOHNSON DAVID12 citations83

FONG JOHN WAI

1 patent

US8334025B2Dec 18, 2012

Antimony-free photocurable resin composition and three dimensional article

FONG JOHN WAI17 citations78

LEYDEN RICHARD N

1 patent

US8227048B2Jul 24, 2012

Photocurable compositions for preparing ABS-like articles

LEYDEN RICHARD N5 citations58