Inventor
KAMIMURA DAIGI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “KAMIMURA DAIGI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
15 patentsUSD939459SDec 28, 2021
Boat for wafer processing apparatus
KOKUSAI ELECTRIC CORP15 citations85
US10636681B2Apr 28, 2020
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP6 citations84
US12123091B2Oct 22, 2024
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP2 citations73
US11555246B2Jan 17, 2023
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP5 citations73
US11512392B2Nov 29, 2022
Substrate processing apparatus
KOKUSAI ELECTRIC CORP2 citations73
US11062918B2Jul 13, 2021
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP2 citations73
US11935762B2Mar 19, 2024
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP3 citations72
US11015248B2May 25, 2021
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP3 citations72
US11450536B2Sep 20, 2022
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP2 citations71
US10998205B2May 4, 2021
Substrate processing apparatus and manufacturing method of semiconductor device
KOKUSAI ELECTRIC CORP5 citations70
US12293939B2May 6, 2025
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11823946B2Nov 21, 2023
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11456190B2Sep 27, 2022
Substrate processing apparatus and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations62
US12518981B2Jan 6, 2026
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US10529605B2Jan 7, 2020
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations41