Inventor
LIN CHUNG-YI
TW42 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHUNG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
18 patentsUS10573573B2Feb 25, 2020
Package and package-on-package structure having elliptical conductive columns
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11282843B2Mar 22, 2022
Memory device, SRAM cell, and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations68
US12507491B2Dec 23, 2025
Storage node light shield for pixel of image sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334489B2Jun 17, 2025
Lthc as charging barrier in info package formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12073165B2Aug 27, 2024
Standard cell design
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12051634B2Jul 30, 2024
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11923353B2Mar 5, 2024
LTHC as charging barrier in info package formation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11756849B2Sep 12, 2023
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11688654B2Jun 27, 2023
Test line structure, semiconductor structure and method for forming test line structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11404341B2Aug 2, 2022
Package and package-on-package structure having elliptical columns and ellipsoid joint terminals
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12550451B2Feb 10, 2026
Electrostatic discharge prevention
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11735579B2Aug 22, 2023
Electrostatic discharge prevention
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11864369B2Jan 2, 2024
Memory device and SRAM cell
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11894263B2Feb 6, 2024
Local interconnect
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10164002B2Dec 25, 2018
Semiconductor device and layout method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9691749B2Jun 27, 2017
Exclusion zone for stress-sensitive circuit design
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12438105B2Oct 7, 2025
Seal ring structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US11036911B2Jun 15, 2021
Charging prevention method and structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
TAIWAN SEMICONDUCTOR MFG
7 patentsUS9099530B2Aug 4, 2015
Methods of patterning small via pitch dimensions
TAIWAN SEMICONDUCTOR MFG108 citations96
US7361986B2Apr 22, 2008
Heat stud for stacked chip package
TAIWAN SEMICONDUCTOR MFG28 citations92
US7116002B2Oct 3, 2006
Overhang support for a stacked semiconductor device, and method of forming thereof
TAIWAN SEMICONDUCTOR MFG34 citations90
US9136211B2Sep 15, 2015
Protected solder ball joints in wafer level chip-scale packaging
TAIWAN SEMICONDUCTOR MFG5 citations73
US8829653B2Sep 9, 2014
Exclusion zone for stress-sensitive circuit design
TAIWAN SEMICONDUCTOR MFG2 citations63
US7138300B2Nov 21, 2006
Structural design for flip-chip assembly
TAIWAN SEMICONDUCTOR MFG3 citations63
US7588963B2Sep 15, 2009
Method of forming overhang support for a stacked semiconductor device
TAIWAN SEMICONDUCTOR MFG4 citations60
FIRST DOME CORP
5 patentsUS9524000B2Dec 20, 2016
Pivot mechanism of synchronous hinge device
FIRST DOME CORP24 citations93
US9310849B2Apr 12, 2016
Dual-shaft synchronous transmission device
FIRST DOME CORP14 citations82
US9309705B2Apr 12, 2016
Dual-shaft synchronous transmission fixing device
FIRST DOME CORP12 citations82
US9678541B2Jun 13, 2017
Pivot shaft transmission device
FIRST DOME CORP2 citations71
US9462713B2Oct 4, 2016
Transmission device applied to pivot shaft mechanism
FIRST DOME CORP4 citations71