Inventor
LAN TZU-KAI
TW6 patents
Patents
6 patentsUS11011487B2May 18, 2021
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US10700030B2Jun 30, 2020
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations70
US11699673B2Jul 11, 2023
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10867951B2Dec 15, 2020
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US10340242B2Jul 2, 2019
Semiconductor device and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US11152295B2Oct 19, 2021
Semiconductor package structure and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47