Inventor
CHEN CHUNG-CHIH
TW13 patents
⚠️ This page may combine multiple inventors who share the name “CHEN CHUNG-CHIH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS10269669B2Apr 23, 2019
Semiconductor package and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations79
US11011487B2May 18, 2021
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US10700030B2Jun 30, 2020
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations70
US11699673B2Jul 11, 2023
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10872831B2Dec 22, 2020
Method of forming a semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
UNITED MICROELECTRONICS CORP
3 patentsUS6251804B1Jun 26, 2001
Method for enhancing adhesion of photo-resist to silicon nitride surfaces
UNITED MICROELECTRONICS CORP21 citations91
US7709878B2May 4, 2010
Capacitor structure having butting conductive layer
UNITED MICROELECTRONICS CORP3 citations61
US6500355B1Dec 31, 2002
Wafer conductive structure for preventing plasma damage
UNITED MICROELECTRONICS CORP4 citations61