Inventor
HSU JR-LIN
TW3 patents
Patents
3 patentsUS11011487B2May 18, 2021
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US10700030B2Jun 30, 2020
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations70
US11699673B2Jul 11, 2023
Semiconductor package having varying conductive pad sizes
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60