Inventor
HERBRANDT ALEXANDER
DE11 patents
⚠️ This page may combine multiple inventors who share the name “HERBRANDT ALEXANDER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
10 patentsUS9275926B2Mar 1, 2016
Power module with cooling structure on bonding substrate for cooling an attached semiconductor chip
INFINEON TECHNOLOGIES AG22 citations91
US9585241B2Feb 28, 2017
Substrate, chip arrangement, and method for manufacturing the same
INFINEON TECHNOLOGIES AG2 citations72
US9731370B2Aug 15, 2017
Directly cooled substrates for semiconductor modules and corresponding manufacturing methods
INFINEON TECHNOLOGIES AG4 citations71
US10693248B2Jun 23, 2020
Method for electrically connecting an electronic module and electronic assembly
INFINEON TECHNOLOGIES AG3 citations68
US11533824B2Dec 20, 2022
Power semiconductor module and a method for producing a power semiconductor module
INFINEON TECHNOLOGIES AG2 citations66
US11114780B2Sep 7, 2021
Electronic module with an electrically conductive press-fit terminal having a press-fit section
INFINEON TECHNOLOGIES AG1 citations58
US12041755B2Jul 16, 2024
Power semiconductor module arrangement and method for producing a power semiconductor module arrangement
INFINEON TECHNOLOGIES AG0 citations56
US11756923B2Sep 12, 2023
High density and durable semiconductor device interconnect
INFINEON TECHNOLOGIES AG0 citations55
US12494440B2Dec 9, 2025
Power semiconductor module and method of increasing pin alignment accuracy for power semiconductor modules
INFINEON TECHNOLOGIES AG0 citations51
US11856718B2Dec 26, 2023
Housing for a power semiconductor module arrangement
INFINEON TECHNOLOGIES AG0 citations44