Inventor

TU CHIH-HUNG

TW2 patents

Patents

2 patents

US9450004B2Sep 20, 2016

Wafer-level encapsulated semiconductor device, and method for fabricating same

OMNIVISION TECH INC8 citations79

US10157943B2Dec 18, 2018

Trenched-bonding-dam device and manufacturing method for same

OMNIVISION TECH INC2 citations66