Inventor
BROFMAN PETER JEFFREY
US4 patents
Patents
4 patentsUS6184062B1Feb 6, 2001
Process for forming cone shaped solder for chip interconnection
IBM56 citations94
US6559527B2May 6, 2003
Process for forming cone shaped solder for chip interconnection
IBM28 citations90
US5868304AFeb 9, 1999
Socketable bump grid array shaped-solder on copper spheres
IBM19 citations80
US6070782AJun 6, 2000
Socketable bump grid array shaped-solder on copper spheres
IBM3 citations59