Inventor
MANISCALCO JOSEPH F
US31 patents
Patents
31 patentsUS10529622B1Jan 7, 2020
Void-free metallic interconnect structures with self-formed diffusion barrier layers
IBM16 citations94
US6124074ASep 26, 2000
Photoresist compositions with cyclic olefin polymers and hydrophobic non-steroidal multi-alicyclic additives
IBM29 citations92
US10049980B1Aug 14, 2018
Low resistance seed enhancement spacers for voidless interconnect structures
IBM7 citations84
US11758819B2Sep 12, 2023
Magneto-resistive random access memory with laterally-recessed free layer
IBM2 citations73
US11183455B2Nov 23, 2021
Interconnects with enlarged contact area
IBM2 citations73
US10950493B1Mar 16, 2021
Interconnects having air gap spacers
IBM2 citations73
US10741748B2Aug 11, 2020
Back end of line metallization structures
IBM2 citations73
US6562554B1May 13, 2003
Photoresist compositions with cyclic olefin polymers and hydrophobic non-steroidal multi-alicyclic additives
IBM6 citations73
US12557555B2Feb 17, 2026
Magnetic tunnel junction with an etched bottom electrode having non-planar sidewalls
IBM0 citations62
US12538714B2Jan 27, 2026
Magneto-resistive random access memory with laterally-recessed free layer
IBM0 citations62
US12349597B2Jul 1, 2025
Conical magnetic random access memory pillar structures
IBM0 citations62
US12342726B2Jun 24, 2025
Etching of magnetic tunnel junction (MTJ) stack for magnetoresistive random-access memory (MRAM)
IBM0 citations62
US12167700B2Dec 10, 2024
Replacement bottom electrode structure for MRAM devices
IBM0 citations62
US12108685B2Oct 1, 2024
Multi-diameter magnetic random-access memory pillar structure
IBM0 citations62
US11682471B2Jun 20, 2023
Dual damascene crossbar array for disabling a defective resistive switching device in the array
IBM0 citations62
US11430690B2Aug 30, 2022
Interconnects having air gap spacers
IBM1 citations62
US10930589B2Feb 23, 2021
Advanced interconnects containing an IMT liner
IBM0 citations62
US10903116B2Jan 26, 2021
Void-free metallic interconnect structures with self-formed diffusion barrier layers
IBM0 citations62
US10686126B2Jun 16, 2020
Back end of line metallization structures
IBM1 citations62
US12040230B2Jul 16, 2024
Encapsulated top via interconnects
IBM0 citations61
US11664271B2May 30, 2023
Dual damascene with short liner
IBM0 citations61
US11177171B2Nov 16, 2021
Encapsulated top via interconnects
IBM0 citations61
US11069566B2Jul 20, 2021
Hybrid sidewall barrier facilitating low resistance interconnection
IBM1 citations58
US12317752B2May 27, 2025
MRAM structure with multilayer encapsulation
IBM0 citations52
US11380641B2Jul 5, 2022
Pillar bump with noble metal seed layer for advanced heterogeneous integration
IBM0 citations52
US10546815B2Jan 28, 2020
Low resistance interconnect structure with partial seed enhancement liner
IBM0 citations52
US10468346B2Nov 5, 2019
Advanced interconnects containing an IMT liner
IBM0 citations52
US10431542B2Oct 1, 2019
Low resistance seed enhancement spacers for voidless interconnect structures
IBM0 citations52
US11282768B2Mar 22, 2022
Fully-aligned top-via structures with top-via trim
IBM0 citations50
US11158538B2Oct 26, 2021
Interconnect structures with cobalt-infused ruthenium liner and a cobalt cap
IBM0 citations50
US10840325B2Nov 17, 2020
Low resistance metal-insulator-metal capacitor electrode
IBM0 citations42