Inventor

KOHINATA MASAYOSHI

JP4 patents

⚠️ This page may combine multiple inventors who share the name “KOHINATA MASAYOSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI MATERIALS CORP

3 patents

US5451279ASep 19, 1995

Method for joining ceramic sintered bodies

MITSUBISHI MATERIALS CORP35 citations91

US5651873AJul 29, 1997

Electroplating solution for forming Pb-Sn alloy bump electrodes on semiconductor wafer surface

MITSUBISHI MATERIALS CORP14 citations72

US7556669B2Jul 7, 2009

Au-sn alloy powder for solder paste

MITSUBISHI MATERIALS CORP3 citations61

MASAYUKI ISHIKAWA

1 patent

US8721961B2May 13, 2014

Au—Sn alloy bump including no large void and method of producing same

MASAYUKI ISHIKAWA0 citations50