Inventor
YEUNG BETTY HILL-SHAN
US5 patents
Patents
5 patentsUS11557525B2Jan 17, 2023
Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements
NXP USA INC3 citations70
US11935809B2Mar 19, 2024
Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements
NXP USA INC0 citations59
US11817366B2Nov 14, 2023
Semiconductor device package having thermal dissipation feature and method therefor
NXP USA INC0 citations59
US11121467B2Sep 14, 2021
Semiconductor package with compact antenna formed using three-dimensional additive manufacturing process
NXP USA INC0 citations50
US12406896B2Sep 2, 2025
Semiconductor device package having thermal dissipation feature and method therefor
NXP USA INC0 citations49