Inventor
HWANG CHAN SEUNG
KR5 patents
Patents
5 patentsUS6492198B2Dec 10, 2002
Method for fabricating a semiconductor device
SAMSUNG ELECTRONICS CO LTD97 citations95
US6455408B1Sep 24, 2002
Method for manufacturing semiconductor devices having redistribution patterns with a concave pattern in a bump pad area
SAMSUNG ELECTRONICS CO LTD134 citations94
US6621164B2Sep 16, 2003
Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD57 citations92
US5923957AJul 13, 1999
Process for manufacturing a lead-on-chip semiconductor device package having a discontinuous adhesive layer formed from liquid adhesive
SAMSUNG ELECTRONICS CO LTD26 citations89
US9070701B2Jun 30, 2015
Semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations61