Inventor
JUNG SEUNG OUK
KR2 patents
Patents
2 patentsUS6455408B1Sep 24, 2002
Method for manufacturing semiconductor devices having redistribution patterns with a concave pattern in a bump pad area
SAMSUNG ELECTRONICS CO LTD134 citations94
US6621164B2Sep 16, 2003
Chip size package having concave pattern in the bump pad area of redistribution patterns and method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD57 citations92