Inventor
TSUKADA YUTAKA
JP26 patents
⚠️ This page may combine multiple inventors who share the name “TSUKADA YUTAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
20 patentsUS6985362B2Jan 10, 2006
Printed circuit board and electronic package using same
IBM70 citations97
US5662987ASep 2, 1997
Multilayer printed wiring board and method of making same
IBM112 citations96
US5451721ASep 19, 1995
Multilayer printed circuit board and method for fabricating same
IBM166 citations96
US5355580AOct 18, 1994
Method for replacing semiconductor chips
IBM82 citations96
US5956843ASep 28, 1999
Multilayer printed wiring board and method of making same
IBM83 citations94
US5883335AMar 16, 1999
Electrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrate
IBM67 citations94
US6378201B1Apr 30, 2002
Method for making a printed circuit board
IBM70 citations93
US5488200AJan 30, 1996
Interconnect structure with replaced semiconductor chips
IBM35 citations92
US5878942AMar 9, 1999
Soldering method and soldering apparatus
IBM40 citations90
US6273328B1Aug 14, 2001
Solder bump forming method and apparatus
IBM22 citations89
US5776662AJul 7, 1998
Method for fabricating a chip carrier with migration barrier, and resulating chip carrier
IBM17 citations84
US9354408B2May 31, 2016
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
IBM12 citations83
US8971678B2Mar 3, 2015
Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductor
IBM5 citations73
US5784781AJul 28, 1998
Manufacturing process for organic chip carrier
IBM7 citations73
US9772462B2Sep 26, 2017
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
IBM2 citations72
US6427898B2Aug 6, 2002
Solder bump forming method and apparatus
IBM5 citations70
US6667559B2Dec 23, 2003
Ball grid array module and method of manufacturing same
IBM6 citations62
US5470796ANov 28, 1995
Electronic package with lead wire connections and method of making same
IBM2 citations59
US5444299AAug 22, 1995
Electronic package with lead wire connections
IBM5 citations59
US6551697B2Apr 22, 2003
Printed circuit board, method of making same, and photomask for use in the method
IBM1 citations52