Inventor · disambiguated record
Bernie Chrisanto Ang
Also filed as: ANG BERNIE CHRISANTO
2 granted patents·1 pending application·2 citations·filing 2012–2013
38Inventor score
Top patents by PatentIndex Score
3 records- 0150US9177903B2Enhanced flip-chip die architectureST MICROELECTRONICS INC·Filed 2013·Granted Nov 3, 2015·1 cites·14 claims
- 0247US9011127B2Method and system for determining and dispensing resin for a compression molding process flowCARINO WILJEE·Filed 2012·Granted Apr 21, 2015·1 cites·20 claims
- 0336US2015179477A1Packaged ic devices and associated ic device packaging methodsST MICROELECTRONICS INC·Filed 2013·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →