Inventor
LIU MING-KAI
TW50 patents
⚠️ This page may combine multiple inventors who share the name “LIU MING-KAI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
40 patentsUS9412661B2Aug 9, 2016
Method for forming package-on-package structure
TAIWAN SEMICONDUCTOR MFG CO LTD50 citations94
US10043761B2Aug 7, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9806045B2Oct 31, 2017
Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US9653417B2May 16, 2017
Method for singulating packaged integrated circuits and resulting structures
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9543373B2Jan 10, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD15 citations84
US11101238B2Aug 24, 2021
Surface mounting semiconductor components
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10510681B2Dec 17, 2019
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10269640B2Apr 23, 2019
Method for singulating packaged integrated circuits and resulting structures
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10163824B2Dec 25, 2018
Integrated fan-out package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US10157900B2Dec 18, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9559071B2Jan 31, 2017
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US9543263B2Jan 10, 2017
Semiconductor packaging and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11929319B2Mar 12, 2024
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11335666B2May 17, 2022
Memory device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11075159B2Jul 27, 2021
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10879170B2Dec 29, 2020
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10504865B2Dec 10, 2019
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11894330B2Feb 6, 2024
Methods of manufacturing a semiconductor device including a joint adjacent to a post
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
USRE49046EApr 19, 2022
Methods and apparatus for package on package devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11211339B2Dec 28, 2021
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10971463B2Apr 6, 2021
Interconnection structure including a metal post encapsulated by a joint material having concave outer surface
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US10964595B2Mar 30, 2021
Method for singulating packaged integrated circuits and resulting structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9953942B2Apr 24, 2018
Semiconductor packaging and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12205888B2Jan 21, 2025
Semiconductor packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12148735B2Nov 19, 2024
Memory device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11127708B2Sep 21, 2021
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12400936B2Aug 26, 2025
Stacked memory cube with integrated thermal path for enhanced heat dissipation
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11551999B2Jan 10, 2023
Memory device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10867957B2Dec 15, 2020
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10312209B2Jun 4, 2019
Manufacturing method of semiconductor package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10304790B2May 28, 2019
Method of fabricating an integrated fan-out package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10269588B2Apr 23, 2019
Integrated circuit underfill scheme
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163846B2Dec 25, 2018
Mechanisms for forming hybrid bonding structures with elongated bumps
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10037959B2Jul 31, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9941240B2Apr 10, 2018
Semiconductor chip scale package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9472523B2Oct 18, 2016
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9460989B2Oct 4, 2016
Interposer having a defined through via pattern
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9875913B2Jan 23, 2018
Method for singulating packaged integrated circuits and resulting structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
US9627325B2Apr 18, 2017
Package alignment structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
US9484308B2Nov 1, 2016
Semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations42
TAIWAN SEMICONDUCTOR MFG
6 patentsUS8994176B2Mar 31, 2015
Methods and apparatus for package with interposers
TAIWAN SEMICONDUCTOR MFG6 citations84
US9373599B2Jun 21, 2016
Methods and apparatus for package on package devices
TAIWAN SEMICONDUCTOR MFG3 citations73
US9331023B1May 3, 2016
Device packaging
TAIWAN SEMICONDUCTOR MFG3 citations73
US9391012B2Jul 12, 2016
Methods and apparatus for package with interposers
TAIWAN SEMICONDUCTOR MFG1 citations63
US9064873B2Jun 23, 2015
Singulated semiconductor structure
TAIWAN SEMICONDUCTOR MFG3 citations63
US9355924B2May 31, 2016
Integrated circuit underfill scheme
TAIWAN SEMICONDUCTOR MFG0 citations52