Inventor

KO TING-CHU

TW28 patents

⚠️ This page may combine multiple inventors who share the name “KO TING-CHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KO TING-CHU

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device and method

Semiconductor device and method

System and methods for converting planar design to FinFET design

Integrated fan-out packages and methods of forming the same

Memory device and manufacturing method thereof

Integrated fan-out packages and methods of forming the same

Semiconductor package and manufacturing method thereof

Package structure and method of manufacturing the same

Simplified carrier removable by reduced number of CMP processes

Semiconductor packages and methods of forming the same

Memory device and manufacturing method thereof

Package structure and method of manufacturing the same

Stacked memory cube with integrated thermal path for enhanced heat dissipation

Semiconductor device and method

Memory device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG

Damascene interconnect structure with cap layer

Structure and method for high performance interconnect

Contact structure of semiconductor device

Strained structure of a semiconductor device

Low resistance and reliable copper interconnects by variable doping

Low resistance and reliable copper interconnects by variable doping

Contact structure of semiconductor device

Electro chemical plating additives for improving stress and leveling effect

WANN CLEMENT HSINGJEN

System and methods for converting planar design to FinFET design

WANN HSINGJEN

Structure and method for high performance interconnect

SHUE SHAU-LIN

Approach to reduce the contact resistance

TAIWAN SEMICONDUCTOR MANFACTUR

Method and apparatus for fabricating metal layer

KO TING-CHU

Low resistance and reliable copper interconnects by variable doping