Inventor
CHAU ON LOK
NL8 patents
⚠️ This page may combine multiple inventors who share the name “CHAU ON LOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FREESCALE SEMICONDUCTOR INC
4 patentsUS7262494B2Aug 28, 2007
Three-dimensional package
FREESCALE SEMICONDUCTOR INC7 citations71
US7494924B2Feb 24, 2009
Method for forming reinforced interconnects on a substrate
FREESCALE SEMICONDUCTOR INC2 citations58
US7422973B2Sep 9, 2008
Method for forming multi-layer bumps on a substrate
FREESCALE SEMICONDUCTOR INC3 citations58
US7279409B2Oct 9, 2007
Method for forming multi-layer bumps on a substrate
FREESCALE SEMICONDUCTOR INC4 citations58
Nexperia BV
4 patentsUS11990394B2May 21, 2024
Semiconductor package and a method for manufacturing of a semiconductor package
Nexperia BV0 citations58
US12512450B2Dec 30, 2025
Semiconductor device and a method of manufacturing a semiconductor device
Nexperia BV1 citations54
US10269751B2Apr 23, 2019
Leadless package with non-collapsible bump
Nexperia BV0 citations50
US11631634B2Apr 18, 2023
Leadless semiconductor package and method of manufacture
Nexperia BV0 citations47