Inventor
GERVASI WILLIAM M
US9 patents
⚠️ This page may combine multiple inventors who share the name “GERVASI WILLIAM M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NETLIST INC
7 patentsUS7839645B2Nov 23, 2010
Module having at least two surfaces and at least one thermally conductive layer therebetween
NETLIST INC83 citations98
US7630202B2Dec 8, 2009
High density module having at least two substrates and at least one thermally conductive layer therebetween
NETLIST INC81 citations98
US7375970B2May 20, 2008
High density memory module using stacked printed circuit boards
NETLIST INC95 citations98
US7254036B2Aug 7, 2007
High density memory module using stacked printed circuit boards
NETLIST INC184 citations98
US8345427B2Jan 1, 2013
Module having at least two surfaces and at least one thermally conductive layer therebetween
NETLIST INC63 citations97
US7286436B2Oct 23, 2007
High-density memory module utilizing low-density memory components
NETLIST INC190 citations97
US8971045B1Mar 3, 2015
Module having at least one thermally conductive layer between printed circuit boards
NETLIST INC0 citations51