Inventor
HAN JUNG KYU
US22 patents
⚠️ This page may combine multiple inventors who share the name “HAN JUNG KYU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
14 patentsUS10431537B1Oct 1, 2019
Electromigration resistant and profile consistent contact arrays
INTEL CORP11 citations83
US11309239B2Apr 19, 2022
Electromigration resistant and profile consistent contact arrays
INTEL CORP2 citations72
US11488918B2Nov 1, 2022
Surface finishes with low rBTV for fine and mixed bump pitch architectures
INTEL CORP3 citations70
US12476214B2Nov 18, 2025
Solder interconnect hierarchy for heterogeneous electronic device packaging
INTEL CORP0 citations62
US12568831B2Mar 3, 2026
Patternable die attach materials and processes for patterning
INTEL CORP0 citations61
US11955448B2Apr 9, 2024
Architecture to manage FLI bump height delta and reliability needs for mixed EMIB pitches
INTEL CORP0 citations61
US11923312B2Mar 5, 2024
Patternable die attach materials and processes for patterning
INTEL CORP0 citations61
US12341117B2Jun 24, 2025
Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substrates
INTEL CORP0 citations60
US11935857B2Mar 19, 2024
Surface finishes with low RBTV for fine and mixed bump pitch architectures
INTEL CORP1 citations60
US12593695B2Mar 31, 2026
Structure and process for warpage reduction
INTEL CORP0 citations59
US12354883B2Jul 8, 2025
Omni directional interconnect with magnetic fillers in mold matrix
INTEL CORP0 citations59
US12334422B2Jun 17, 2025
Methods and apparatus to reduce defects in interconnects between semicondcutor dies and package substrates
INTEL CORP0 citations55
US12525497B2Jan 13, 2026
Microelectronic assemblies with adaptive multi-layer encapsulation materials
INTEL CORP0 citations51
US10854541B2Dec 1, 2020
Electromigration resistant and profile consistent contact arrays
INTEL CORP0 citations51
HYUNDAI MOTOR CO LTD
2 patentsUS11025161B2Jun 1, 2021
Electric vehicle and charging apparatus thereof
HYUNDAI MOTOR CO LTD1 citations59
US12060485B2Aug 13, 2024
Low gloss non-coating thermoplastic resin composition, method for manufacturing molded article by using the same, and molded article manufactured through the same
HYUNDAI MOTOR CO LTD0 citations45
SEOUL NAT UNIV R&DB FOUNDATION
2 patentsUS10130660B2Nov 20, 2018
Peripheral blood stem cells with improved angiogenic properties and use thereof
SEOUL NAT UNIV R&DB FOUNDATION0 citations48
US10561688B2Feb 18, 2020
Method for preparing of endothelial cells by transformation (transdifferentiation) of adult fibroblast, and use thereof
SEOUL NAT UNIV R&DB FOUNDATION0 citations45