Inventor

HSU CHIA RUNG

TW2 patents

Patents

2 patents

US7294575B2Nov 13, 2007

Chemical mechanical polishing process for forming shallow trench isolation structure

UNITED MICROELECTRONICS CORP7 citations70

US7172970B2Feb 6, 2007

Polish method for semiconductor device planarization

UNITED MICROELECTRONICS CORP2 citations56