Inventor · disambiguated record
Byeonggyu Hwang
Also filed as: Hwang Byeonggyu
3 granted patents·6 pending applications·1 citations·filing 2016–2024
47Inventor score
Files withSAMSUNG SDI CO LTD9
Top patents by PatentIndex Score
9 records- 0171US10106687B2Composition for forming silica layer, method for manufacturing silica layer and silica layerSAMSUNG SDI CO LTD·Filed 2016·Granted Oct 23, 2018·1 cites·12 claims
- 0269US2025130493A1Resist underlayer composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0368US2025068076A1Resist underlayer composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0454US2024272556A1Metal containing photoresist developer composition, and method of forming patterns including step of developing using the compositionSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 0551US2024019784A1Metal containing photoresist developer composition, and method of forming patterns including step of developing using the compositionSAMSUNG SDI CO LTD·Filed 2023·Application pending·0 cites
- 0650US2025093777A1Resist underlayer composition and method of forming patterns using the compositionSAMSUNG SDI CO LTD·Filed 2024·Application pending·0 cites
- 0743US11201052B2Composition for forming silica layer, silica layer and electronic device incorporating silica layerSAMSUNG SDI CO LTD·Filed 2020·Granted Dec 14, 2021·0 cites·13 claims
- 0842US10804095B2Composition for forming silica layer, silica layer, and electronic deviceSAMSUNG SDI CO LTD·Filed 2018·Granted Oct 13, 2020·0 cites·16 claims
- 0939US2021324235A1Composition for forming silica layer, silica layer formed therefrom, and electronic device including silica layerSAMSUNG SDI CO LTD·Filed 2021·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →