Inventor

ACHARI MURUGASAN MANIKAM

MY4 patents

⚠️ This page may combine multiple inventors who share the name “ACHARI MURUGASAN MANIKAM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SPANSION LLC

3 patents

US7759171B2Jul 20, 2010

Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package

SPANSION LLC4 citations53

US7846771B2Dec 7, 2010

Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices

SPANSION LLC0 citations51

US7414305B2Aug 19, 2008

Carrier for stacked type semiconductor device and method of fabricating stacked type semiconductor devices

SPANSION LLC0 citations51

HUSSIN PAKHORUDIN

1 patent

US8546936B2Oct 1, 2013

Method and structure of minimizing mold bleeding on a substrate surface of a semiconductor package

HUSSIN PAKHORUDIN0 citations36