Inventor
NAGASAWA TADATO
JP5 patents
⚠️ This page may combine multiple inventors who share the name “NAGASAWA TADATO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DISCO CORP
4 patentsUS7527547B2May 5, 2009
Wafer processing method
DISCO CORP8 citations82
US7179724B2Feb 20, 2007
Wafer processing method
DISCO CORP11 citations82
US7549560B2Jun 23, 2009
Wafer dividing method
DISCO CORP6 citations60
US7439162B2Oct 21, 2008
Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform
DISCO CORP4 citations57