Inventor
RYU HYO-CHANG
KR9 patents
⚠️ This page may combine multiple inventors who share the name “RYU HYO-CHANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS8829686B2Sep 9, 2014
Package-on-package assembly including adhesive containment element
SAMSUNG ELECTRONICS CO LTD24 citations91
US11721679B2Aug 8, 2023
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD1 citations71
US11145637B2Oct 12, 2021
Semiconductor package including a substrate having two silicon layers formed on each other
SAMSUNG ELECTRONICS CO LTD4 citations71
US12278222B2Apr 15, 2025
Method of fabricating semiconductor package including sub-interposer substrates
SAMSUNG ELECTRONICS CO LTD0 citations61
US11670565B2Jun 6, 2023
Semiconductor package with heat dissipation member
SAMSUNG ELECTRONICS CO LTD0 citations61
US10950521B2Mar 16, 2021
Thermal interface material layer and package-on-package device including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11217503B2Jan 4, 2022
Semiconductor package having logic semiconductor chip and memory packages on interposer
SAMSUNG ELECTRONICS CO LTD0 citations51
US10431522B2Oct 1, 2019
Thermal interface material layer and package-on-package device including the same
SAMSUNG ELECTRONICS CO LTD0 citations50