Inventor
CARTAS AYALA MARCO AURELIO
US3 patents
Patents
3 patentsUS11948906B2Apr 2, 2024
Hybrid backside thermal structures for enhanced IC packages
INTEL CORP2 citations69
US12482779B2Nov 25, 2025
Hybrid backside thermal structures for enhanced ic packages
INTEL CORP0 citations58
US11676873B2Jun 13, 2023
Semiconductor package having sealant bridge
INTEL CORP0 citations53