Inventor

HUTTO KEVIN

US2 patents

⚠️ This page may combine multiple inventors who share the name “HUTTO KEVIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

1 patent

US7560371B2Jul 14, 2009

Methods for selectively filling apertures in a substrate to form conductive vias with a liquid using a vacuum

MICRON TECHNOLOGY INC14 citations82

HUTTO KEVIN

1 patent

US8314498B2Nov 20, 2012

Isolated bond pad with conductive via interconnect

HUTTO KEVIN6 citations61