Inventor

NG MING WAI KELVIN

HK2 patents

Patents

2 patents

US7002283B2Feb 21, 2006

Ultrasonic transducer assembly

ASM ASSEMBLY AUTOMATION LTD50 citations87

US7240711B2Jul 10, 2007

Apparatus and method for alignment of a bonding tool

ASM ASSEMBLY AUTOMATION LTD9 citations66