Inventor
KANAI FUMIYUKI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “KANAI FUMIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
9 patentsUS5449411ASep 12, 1995
Microwave plasma processing apparatus
HITACHI LTD82 citations96
US5444012AAug 22, 1995
Method for manufacturing semiconductor integrated circuit device having a fuse element
HITACHI LTD84 citations95
US5188975AFeb 23, 1993
Method of producing a connection hole for a DRAM having at least three conductor layers in a self alignment manner.
HITACHI LTD38 citations92
US5880497AMar 9, 1999
Semiconductor integrated circuit device having capacitance element and process of manufacturing the same
HITACHI LTD18 citations91
US5508540AApr 16, 1996
Semiconductor integrated circuit device and process of manufacturing the same
HITACHI LTD30 citations91
US6307217B1Oct 23, 2001
Semiconductor memory device having driver and load MISFETs and capacitor elements
HITACHI LTD15 citations83
US5670409ASep 23, 1997
Method of fabricating a semiconductor IC DRAM device enjoying enhanced focus margin
HITACHI LTD14 citations74
US5347100ASep 13, 1994
Semiconductor device, process for the production thereof and apparatus for microwave plasma treatment
HITACHI LTD13 citations73
US6512245B2Jan 28, 2003
Semiconductor integrated circuit device
HITACHI LTD2 citations62
SEIKO EPSON CORP
4 patentsUS5896150AApr 20, 1999
Ink-jet type recording head
SEIKO EPSON CORP40 citations93
US6309057B1Oct 30, 2001
Ink-jet type recording head
SEIKO EPSON CORP9 citations74
US5230731AJul 27, 1993
Hot-melt ink composition
SEIKO EPSON CORP16 citations70
US7905562B2Mar 15, 2011
Liquid guiding device and liquid ejecting apparatus
SEIKO EPSON CORP0 citations41
RENESAS TECH CORP
4 patentsUS6979649B2Dec 27, 2005
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP12 citations91
US7250365B2Jul 31, 2007
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP10 citations83
US7718526B2May 18, 2010
Fabrication method of semiconductor integrated circuit device
RENESAS TECH CORP2 citations61
US7052995B2May 30, 2006
Process of manufacturing semiconductor device including chemical-mechanical polishing
RENESAS TECH CORP2 citations60