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Inventor
HAUBNER GERHARD
DE
2 patents
Patents
2 patents
US10916484B2
Feb 9, 2021
Electronic device including redistribution layer pad having a void
INFINEON TECHNOLOGIES AG
0 citations
48
US10607911B2
Mar 31, 2020
Chip carrier laminate with high frequency dielectric and thermomechanical buffer
INFINEON TECHNOLOGIES AG
0 citations
31