Inventor
JAMIL OWAIS
US4 patents
Patents
4 patentsUS6678952B2Jan 20, 2004
Method of making a microelectronic package including a component having conductive elements on a top side and a bottom side thereof
TESSERA INC13 citations79
US7067742B2Jun 27, 2006
Connection component with peelable leads
TESSERA INC9 citations73
US6357112B1Mar 19, 2002
Method of making connection component
TESSERA INC8 citations73
US7188413B2Mar 13, 2007
Method of making a microelectronic package
TESSERA INC8 citations69