Inventor
HO CHIEN-HSIN
TW5 patents
⚠️ This page may combine multiple inventors who share the name “HO CHIEN-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS10453740B2Oct 22, 2019
Interconnect structure without barrier layer on bottom surface of via
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations71
US12308282B2May 20, 2025
Interconnect structure without barrier layer on bottom surface of via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11322391B2May 3, 2022
Interconnect structure without barrier layer on bottom surface of via
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US9842767B2Dec 12, 2017
Method of forming an interconnection
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50