Inventor
CHEN WENG-YI
TW22 patents
⚠️ This page may combine multiple inventors who share the name “CHEN WENG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
16 patentsUS10640368B2May 5, 2020
Semiconductor sensor and method of manufacturing the same
UNITED MICROELECTRONICS CORP5 citations82
US12103845B2Oct 1, 2024
Micro-electromechanical system and method for fabricating MEMS having protection wall
UNITED MICROELECTRONICS CORP2 citations72
US10737932B2Aug 11, 2020
Micro-electro-mechanical system structure and method for fabricating the same
UNITED MICROELECTRONICS CORP2 citations71
US9950920B2Apr 24, 2018
Micro-electro-mechanical system structure and method for forming the same
UNITED MICROELECTRONICS CORP2 citations71
US9961450B2May 1, 2018
Piezoresistive microphone and method of fabricating the same
UNITED MICROELECTRONICS CORP3 citations70
US12441606B2Oct 14, 2025
MEMS device including coil structure with corrugated polymer film
UNITED MICROELECTRONICS CORP0 citations62
US11345590B2May 31, 2022
Semiconductor sensor and method of manufacturing the same
UNITED MICROELECTRONICS CORP0 citations60
US6129950AOct 10, 2000
Method of forming a thick polysilicon layer
UNITED MICROELECTRONICS CORP1 citations51
US10870576B2Dec 22, 2020
Semiconductor sensor and method of manufacturing the same
UNITED MICROELECTRONICS CORP0 citations50
US10475640B2Nov 12, 2019
Method for manufacturing semiconductor device
UNITED MICROELECTRONICS CORP0 citations50
US10457546B2Oct 29, 2019
Micro-electro-mechanical system structure and method for forming the same
UNITED MICROELECTRONICS CORP0 citations50
US10115582B2Oct 30, 2018
Semiconductor device and method for manufacturing the same
UNITED MICROELECTRONICS CORP1 citations50
US10427935B2Oct 1, 2019
Manufacturing method for semiconductor structure
UNITED MICROELECTRONICS CORP0 citations49
US10112825B2Oct 30, 2018
Semiconductor structure and manufacturing method for the same
UNITED MICROELECTRONICS CORP1 citations49
US10773953B2Sep 15, 2020
MEMS structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations48
US9790088B2Oct 17, 2017
MEMS structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations48
UNITED INTEGRATED CIRCUITS CORP
4 patentsUS6207498B1Mar 27, 2001
Method of fabricating a coronary-type capacitor in an integrated circuit
UNITED INTEGRATED CIRCUITS CORP15 citations82
US6051464AApr 18, 2000
Method for fabricating a capacitor of a DRAM with an HSG layer
UNITED INTEGRATED CIRCUITS CORP7 citations72
US6221747B1Apr 24, 2001
Method of fabricating a conductive plug with a low junction resistance in an integrated circuit
UNITED INTEGRATED CIRCUITS CORP4 citations60
US6121114ASep 19, 2000
Method for preparing a dummy wafer
UNITED INTEGRATED CIRCUITS CORP1 citations51