Inventor
LESCHKIES KURTIS
US35 patents
Patents
35 patentsUS11018032B2May 25, 2021
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC15 citations94
US10636677B2Apr 28, 2020
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC17 citations94
US10529585B2Jan 7, 2020
Dry stripping of boron carbide hardmask
APPLIED MATERIALS INC19 citations94
US10276411B2Apr 30, 2019
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC25 citations94
US10096516B1Oct 9, 2018
Method of forming a barrier layer for through via applications
APPLIED MATERIALS INC25 citations94
US11462417B2Oct 4, 2022
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC6 citations86
US10636669B2Apr 28, 2020
Seam healing using high pressure anneal
APPLIED MATERIALS INC15 citations86
US11676832B2Jun 13, 2023
Laser ablation system for package fabrication
APPLIED MATERIALS INC7 citations85
US10790183B2Sep 29, 2020
Selective oxidation for 3D device isolation
APPLIED MATERIALS INC14 citations85
US11257790B2Feb 22, 2022
High connectivity device stacking
APPLIED MATERIALS INC3 citations73
US11232951B1Jan 25, 2022
Method and apparatus for laser drilling blind vias
APPLIED MATERIALS INC2 citations73
US10937726B1Mar 2, 2021
Package structure with embedded core
APPLIED MATERIALS INC3 citations73
US10259007B2Apr 16, 2019
Method and apparatus for aligning nanowires deposited by an electrospinning process
APPLIED MATERIALS INC2 citations71
US12518986B2Jan 6, 2026
Laser ablation system for package fabrication
APPLIED MATERIALS INC0 citations62
US12388049B2Aug 12, 2025
High connectivity device stacking
APPLIED MATERIALS INC0 citations62
US12374611B2Jul 29, 2025
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US12358073B2Jul 15, 2025
Method and apparatus for laser drilling blind vias
APPLIED MATERIALS INC0 citations62
US12087679B2Sep 10, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11881447B2Jan 23, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11862546B2Jan 2, 2024
Package core assembly and fabrication methods
APPLIED MATERIALS INC0 citations62
US11742330B2Aug 29, 2023
High connectivity device stacking
APPLIED MATERIALS INC0 citations62
US11694912B2Jul 4, 2023
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC0 citations62
US11469113B2Oct 11, 2022
High pressure and high temperature anneal chamber
APPLIED MATERIALS INC0 citations62
US11400545B2Aug 2, 2022
Laser ablation for package fabrication
APPLIED MATERIALS INC0 citations62
US11177128B2Nov 16, 2021
Apparatus and methods for manufacturing semiconductor structures using protective barrier layer
APPLIED MATERIALS INC0 citations62
US11227797B2Jan 18, 2022
Film deposition using enhanced diffusion process
APPLIED MATERIALS INC0 citations60
US11705365B2Jul 18, 2023
Methods of micro-via formation for advanced packaging
APPLIED MATERIALS INC0 citations52
US10818490B2Oct 27, 2020
Controlled growth of thin silicon oxide film at low temperature
APPLIED MATERIALS INC0 citations52
US10636705B1Apr 28, 2020
High pressure annealing of metal gate structures
APPLIED MATERIALS INC0 citations52
US10559496B2Feb 11, 2020
Techniques for filling a structure using selective surface modification
APPLIED MATERIALS INC0 citations52
US10490411B2Nov 26, 2019
Method for enabling self-aligned lithography on metal contacts and selective deposition using free-standing vertical carbon structures
APPLIED MATERIALS INC0 citations52
US10283344B2May 7, 2019
Supercritical carbon dioxide process for low-k thin films
APPLIED MATERIALS INC0 citations52
US9935005B2Apr 3, 2018
Techniques for filling a structure using selective surface modification
APPLIED MATERIALS INC0 citations52
US9385239B2Jul 5, 2016
Buffer layers for metal oxide semiconductors for TFT
APPLIED MATERIALS INC0 citations51
US8895351B2Nov 25, 2014
Method and apparatus of forming a conductive layer
APPLIED MATERIALS INC0 citations51