Inventor

CHEN HAN-WEN

US51 patents

⚠️ This page may combine multiple inventors who share the name “CHEN HAN-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN HAN-WEN

APPLIED MATERIALS INC

Method of redistribution layer formation for advanced packaging applications

Package structure and fabrication methods

Package structure and fabrication methods

Method of reconstituted substrate formation for advanced packaging applications

Laser ablation system for package fabrication

Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device STR

Cleaning submicron structures on a semiconductor wafer surface

Post-ion implant cleaning for silicon on insulator substrate preparation

Method for substrate registration and anchoring in inkjet printing

Method for substrate registration and anchoring in inkjet printing

Method for via formation by micro-imprinting

High connectivity device stacking

Substrate structuring methods

Package structure with embedded core

Method for via formation in flowable epoxy materials by micro-imprint

Small thermal mass pressurized chamber

Substrate support and baffle apparatus

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Package structures with built-in EMI shielding

Semiconductor device packages

Laser ablation system for package fabrication

High connectivity device stacking

Package core assembly and fabrication methods

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Package core assembly and fabrication methods

Package structure and fabrication methods

Package core assembly and fabrication methods

Package core assembly and fabrication methods

Substrate structuring methods

Method for substrate registration and anchoring in inkjet printing

High connectivity device stacking

Package structure and fabrication methods

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Drying process for high aspect ratio features

Laser ablation for package fabrication

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Methods for improved polymer-copper adhesion

Substrate structuring methods

Anchoring dies using 3D printing to form reconstructed wafer

Reconstituted substrate structure and fabrication methods for heterogeneous packaging integration

Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures

Drying process for high aspect ratio features

Substrate support and baffle apparatus

Stiction-free drying process with contaminant removal for high-aspect ratio semiconductor device structures

Methods of micro-via formation for advanced packaging

Method of fine redistribution interconnect formation for advanced packaging applications

Reduced volume processing chamber

Supercritical carbon dioxide process for low-k thin films

Post-ion implant cleaning for silicon on insulator substrate preparation

GOUK ROMAN

Method of BARC removal in semiconductor device manufacturing